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SENSOR PCB ASSEMBLY 20I,RPU 20I MOTHER PCB,RPU 20I BACK PLANE PCB,RPU 20I KEY PAD PCB,AO MODULE,POW

EndedGEM

SENSOR PCB ASSEMBLY 20I,RPU 20I MOTHER PCB,RPU 20I BACK PLANE PCB,RPU 20I KEY PAD PCB,AO MODULE,POW

tiruchirappalli, tamil nadu, INDIA

Publish Date : 03 July 2026
End Date : 06 July 2026
EMD: Refer to documents
Bid Value: Refer to documents

Tender TypeOPEN
Contract TypeTender
Total Quantity 16

Overview Specifications Documents Similar Tenders

Tender Overview

TEB ID: TEB/2026/G/04271638

Technical Specifications

Access Full Tender Details

Dummy DataQuantity: 12

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Tender Documents

Bid Document
spec_2026-06-24-14-12-00_e609362768ca40e9c1256bdf256f75dd.pdf
boq_2026-06-24-14-12-00_0689958b503c590c2b9f7b20db2b68d9.csv

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