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Customized Semiconductor Wafer Bonder Setup,Optical Inspection Unit With Universal Zoom Head And Tilting Frame

ActiveGEM-CPPP

Customized Semiconductor Wafer Bonder Setup,Optical Inspection Unit With Universal Zoom Head And Tilting Frame

CENTRAL, DELHI, INDIA

Publish Date : 28 July 2026
End Date : 08 August 2026
EMD: Refer to documents
Bid Value: Refer to documents

Tender TypeOPEN
Contract TypeTender
Total Quantity 2
CategoryIndustry-Machinery and Equipment

Overview Specifications Documents Similar Tenders

Tender Overview

TEB ID: TEB/2026/G/05356907

Customized Semiconductor Wafer Bonder Setup,Optical Inspection Unit With Universal Zoom Head And Tilting Frame

Customized Semiconductor Wafer Bonder Setup,Optical Inspection Unit With Universal Zoom Head And Tilting Frame

Technical Specifications

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Dummy DataQuantity: 12

Category	Parameter	Value
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Tender Documents

tender_document.pdf

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